Rzgar Mohammed Abdalrahman
Technical college of Sulaimani , Department of Production Engineering and Metallurgy
Abstract.
The research presents some experimental data concerning the relation between the shearing strength
of soldered joints and holding time. Two types of solders ASTM 50A (Sn50Pb50) and ASTM 63A
(Sn63Pb37) were used to joint medium carbon steel type DIN CK50 of 3 mm thickness. Lap joint design
was employed. Muffle furnace used for heating with holding (reflow or dwell) times of 10, 20, 30, 35, 40,
45 and 50min. Maximum shear strength was obtained when the eutectic solder (ASTM 63A) used with 35
min. as holding time. Clear intermetallic compounds were shown at the interface, whereas the X-ray
detected the formation of many phases like FeSn and FeSn2.
Keywords: soldered joints, solders, shear tests, intermetallic compounds.
References:
1. Milan Brožek, Alexandra Nováková,“ Soldering of steel using soft solders”, Engineering for Rural Development, Jelgava, LATVIA, 8th International Scientific Conference, 28.-29. May, 2009,315-318.
2. AWS, 2nd Edition, “Soldering Manual”, April 1, 1979. 3. Mittal J., Lin K.L.“Activities during melting and reflowing behavior of solders” Soldering Surface Mount Technology, 2010,22(1),4- 10.
4. Molleda F., Mora J., Molleda F. J., Carillo E. and Mellor B. G., “Soldering of mild steels: Functional joints”, Materials Characterization, 2003, 51( 5),285-292.
5. Chawala N., Shen Y.-L., .Deng X, and Ege E.S., “An Evaluation of the Lap-Shear Test for Sn-Rich Solder/Cu Couples: Experiments and Simulation”, Journal of Electronic Materials, 2004,33(12),1589-1595.
6. Lenora Quan, Darrel Frear, Dennis Grivas, J.W.Morris JR, “Tensile Behavior of Pb- Sn Solder/ Cu Joints“, Journal of Electronic Materials, 1987,16(3)203-208.
7. “Soldering –Sec.6” ASTM, 1981, 32-76.
8. Jianbiao Pan, Brain J.Toleno, Tzu-Chien Chou, Wesley J.Dee,”Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force “, Soldering & Surface Mount Technology, 2006,18(4),48–56.
9. Suezawa Yoshifumi, “Study on Pb-Sn Soldered Joint Strength of Steel Plates”, Journal of the Society of Materials Science, Japan, 1977,26(285),558-564.
10. Matin M.A., Vellinga W.P., Geers M.G.D.,”The microstructural Evolution of Sn-Pb Solder”, Eindhoven University of Technology, Department of Mechanical Engineering, Internal Poster (2002), this is the html version of the file: (http://www.mate.tue.nl/mate/pdfs/2476.pdf).
11. Kim1 S. B. and Jin Yu1” Effects of Solder Ball Geometry on Lap Shear Creep Rate”, Journal of Electronic Materials , March, 2010,39(3) ,326-332.
12. Barranger, J., “Setting Standards for Solderability”, Welding and Metal. Fabrication, May, 1980,48,267-271.
